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SilverStone XED120 WS 450W TDP 8 Heatpipe 120mm PWM 4U Server CPU Cooler

SilverStone XED120 WS 450W TDP 8 Heatpipe 120mm PWM 4U Server CPU Cooler

The SilverStone XED120 WS is a high-performance 450W TDP cooling solution engineered specifically for dual-socket server and workstation environments. It optimizes thermal management for high-density 4U rackmount systems while ensuring compatibility with the latest Intel and AMD enterprise sockets.


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Description

The SilverStone XED120 WS represents a specialized thermal solution for high-performance computing, delivering a massive 450W TDP cooling capacity within a 145mm height profile. Designed for 4U rackmount chassis, it utilizes a front-to-back airflow configuration that simultaneously cools the CPU and surrounding Voltage Regulator Module (VRM) components. This cooler is built for the rigors of 24/7 server operations, featuring eight 6mm copper heatpipes and a high-pressure 120mm dual ball bearing fan to maintain stability under extreme computational loads.


This product is for:
- Data center engineers requiring high-density 4U rackmount cooling for dual-socket Intel LGA4677 or AMD SP5 configurations.
- Workstation professionals using AMD Ryzen Threadripper PRO or EPYC processors for heavy rendering and computational tasks.
- System integrators building industrial-grade servers that demand 450W TDP thermal headroom for sustained peak performance.
- IT managers looking for reliable, dual ball bearing fan solutions to minimize downtime in mission-critical server environments.
- AI and machine learning researchers utilizing multi-core server CPUs that generate significant heat near VRM modules.

Detailed specifications:
- Thermal Design Power (TDP): 450W
- Dimensions: 145mm height (4U rackmount compatible)
- Heatpipes: 8 x Ø6mm high-efficiency copper heatpipes
- Fan Specifications: 120mm x 120mm x 30mm PWM dual ball bearing fan
- Intel Socket Support: LGA4677, LGA4710
- AMD Socket Support: SP5, SP6, sTR5, SP3, TR4, sWRX8, sWRX9
- Material: Aluminum fins with copper heatpipes and metal fan brackets

Operating the XED120 WS in a workstation environment reveals its focus on industrial stability. The 30mm thick PWM fan provides significantly higher static pressure than standard 25mm fans, effectively pushing air through the dense aluminum fin stack. The front-to-back airflow design is particularly effective in multi-socket motherboards, preventing heat soak between adjacent processors. During high-load computational cycles, the dual ball bearing motor maintains a consistent acoustic profile without the rattling often found in sleeve bearing alternatives, ensuring longevity in continuous-use scenarios.

Compared to standard consumer tower coolers, the XED120 WS is specifically height-restricted to 145mm to ensure 4U rackmount clearance, whereas consumer models often exceed 160mm. Unlike generic server heatsinks that rely on high-RPM chassis fans, the XED120 WS includes a dedicated 120mm PWM fan, offering a more controlled and quieter thermal solution for workstations. Its 8-heatpipe array provides a higher thermal ceiling than the 6-heatpipe designs typically found in entry-level server coolers, making it suitable for top-tier EPYC and Xeon Scalable processors.

Q&A:
- Does the SilverStone XED120 WS fit in a standard 4U rackmount case? Yes, with a total height of 145mm, it is specifically designed to meet 4U chassis height requirements.
- Is this cooler compatible with AMD Threadripper PRO sockets? Yes, it supports sWRX8, sWRX9, and sTR5 sockets used by Threadripper and Threadripper PRO series.
- What is the benefit of the dual ball bearing fan? Dual ball bearings offer a longer lifespan and better reliability in high-temperature server environments compared to fluid dynamic or sleeve bearings.
- Can this cooler handle the heat of an Intel Sapphire Rapids processor? With a 450W TDP rating, it is fully capable of cooling high-core-count Intel LGA4677 Sapphire Rapids CPUs.
- How does the airflow design affect VRM temperatures? The front-to-back airflow path ensures that exhaust air moves across the voltage regulator modules, helping to maintain motherboard stability under heavy loads.
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