Description
The Lian Li Lancool II Mesh ARGB Type-C redefines the balance between thermal efficiency and modular convenience. Built with a robust 0.8mm SGCC steel frame and dual 4.0mm tempered glass flip panels, this chassis prioritizes both durability and ease of access. The inclusion of a dedicated USB 3.1 Type-C port on the I/O panel ensures compatibility with the latest high-speed peripherals, while the mesh front panel facilitates unrestricted airflow for power-hungry components.
This product is for:
- PC Gamers: Ideal for those running high-TDP GPUs and CPUs who require consistent cooling to prevent thermal throttling during intense sessions.
- RGB Enthusiasts: Perfect for builders who want out-of-the-box lighting synchronization via the three included 120mm ARGB fans and integrated controller.
- Workstation Users: Supports E-ATX motherboards (up to 280mm wide), making it a viable choice for professional multi-core processing setups.
- Storage-Heavy Users: With capacity for up to nine drives (six SSDs and three HDDs), it caters to content creators and data hoarders.
- First-Time Builders: The modular cable management covers and flip-open panels simplify the assembly process and maintenance.
Detailed specifications:
- Dimensions: 478mm (D) x 229mm (W) x 494mm (H).
- Motherboard Support: E-ATX (under 280mm), ATX, M-ATX, ITX.
- Cooling Support: Front (3x 120mm or 2x 140mm fans; up to 360mm radiator), Top (2x 120/140mm fans; up to 240mm radiator), Rear (1x 120mm).
- Component Clearance: GPU length up to 384mm, CPU cooler height up to 176mm, PSU length up to 210mm.
- I/O Ports: 2x USB 3.0, 1x USB 3.1 Type-C, Audio Jack, LED Color/Mode buttons.
- Materials: 0.8mm SGCC steel, 4.0mm tempered glass side panels.
Building in the Lancool II Mesh is a streamlined experience thanks to its tool-less design and hinged panels. The flip-down shroud panels allow quick access to the PSU and drive cages without removing the main glass side. Thermal testing reveals that the high-density mesh front significantly lowers internal temperatures compared to solid-front alternatives, even when utilizing air-cooling solutions. The cable management bars effectively hide clutter, resulting in a clean interior that showcases the ARGB lighting through the crystal-clear tempered glass.
Compared to the original Lancool II, the Mesh version replaces the solid front with a perforated panel, drastically improving intake volume. While the Lancool 215 offers larger 200mm fans, the Lancool II Mesh provides superior modularity and higher build quality with its thicker steel construction and more versatile storage options. It stands as a more premium alternative to the Phanteks Eclipse series, offering easier access via the dual-hinged glass doors.
Q&A:
- Does this case include a USB-C port? Yes, this updated version includes a factory-installed USB 3.1 Type-C port on the top I/O panel.
- What is the maximum radiator size supported? The front panel supports radiators up to 360mm, while the top supports up to 240mm.
- Can I fit an E-ATX motherboard? Yes, it supports E-ATX motherboards with a maximum width of 280mm.
- How many fans are included? It comes with three 120mm ARGB fans pre-installed in the front.
- Are there dust filters included? The case features integrated mesh filtration on the front, top, and bottom to minimize internal dust buildup.