Description
The InWin F3 redefines the Micro-ATX form factor by combining a sleek, minimalist aesthetic with the versatility required for modern high-end hardware. Engineered with SECC galvanized steel and tempered glass, this mini-tower supports the latest back-connect motherboards, ensuring a clutter-free interior. Despite its compact 460 x 215 x 359 mm footprint, it accommodates triple-slot graphics cards and advanced cooling solutions, bridging the gap between small form factor efficiency and enthusiast-grade performance.
This product is for:
- Minimalist Enthusiasts: Users who prioritize a clean, professional look with premium materials like tempered glass and optional wood accents.
- High-Performance Gamers: Builders needing to fit full-sized GPUs up to 340mm into a smaller chassis without sacrificing thermal performance.
- Cable Management Perfectionists: Specifically designed to support back-connect motherboards (BTF/Project Zero) for a wireless-look interior.
- Compact Workstation Users: Professionals requiring high-speed connectivity via USB 3.2 Gen 2x2 Type-C for fast data transfers.
- Small Form Factor (SFF) Transitioners: Those moving from mid-towers to Micro-ATX who still want compatibility with standard ATX power supplies.
Detailed specifications:
- Motherboard Compatibility: Micro-ATX, Mini-ITX (Supports back-connect designs).
- GPU Clearance: Up to 340 mm length.
- CPU Cooler Clearance: Up to 160 mm height.
- Storage Bays: 1 x 3.5"/2.5" combo, plus additional 2.5" or 3.5" mounts depending on configuration.
- Front I/O: 1 x USB 3.2 Gen 2x2 Type-C, 2 x USB 3.2 Gen 1, HD Audio Combo.
- Cooling Support: Up to 280mm radiator on top; 1 x 120mm rear (pre-installed AN120 fan); 2 x 120mm bottom.
- PSU Support: ATX12V up to 160mm length.
Building in the InWin F3 is a streamlined experience thanks to its thoughtful internal layout. The vertical airflow path, supported by bottom intake fans and a pre-installed AN120 fan, ensures that even high-TDP components remain cool under load. The inclusion of a USB 3.2 Gen 2x2 Type-C port on the I/O panel provides future-proof connectivity for external NVMe drives and modern peripherals. The tool-less panels and support for back-plug motherboards significantly reduce assembly time while achieving a gallery-grade visual result.
Compared to traditional Micro-ATX cases, the InWin F3 stands out with its specific optimization for back-connect motherboards, a feature often reserved for larger mid-tower cases. While many SFF cases require expensive SFX power supplies, the F3 maintains a compact volume while supporting standard ATX PSUs up to 160mm. Its thermal design is more robust than the InWin A1 series, offering superior radiator support (up to 280mm) and better clearance for modern, thicker RTX 40-series graphics cards.
Q&A:
- Does the InWin F3 support the ASUS BTF or MSI Project Zero motherboards? Yes, the chassis is specifically designed with cutouts to accommodate back-connect motherboard connectors.
- What is the maximum radiator size I can install? The top panel supports liquid cooling radiators up to 240mm or 280mm for efficient heat dissipation.
- Can I fit a standard ATX power supply in this case? Yes, it supports ATX12V power supplies with a length of up to 160mm, including cable management space.
- How many fans are included with the purchase? The case comes with one pre-installed InWin AN120 (Black) or AN120P (White) ARGB fan at the rear.
- What are the differences between the Black and White versions? The Black version features a sleek all-metal and glass look, while the White version incorporates premium wood accents for a lifestyle aesthetic.
